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Cova Scientific By Cova Scientific • December 15, 2015

Bulk Thermal Conductivity Values Of Typical Epoxy Filler Materials


Epoxy polymers utilize filler materials in order to achieve high levels of bulk thermal conductivity for thermal management applications. Although the majority of these thermally conductive epoxies use alumina as the main filler material, several other materials are commonly used as well. This post is dedicated to exploring the bulk thermal conductivity of most commonly used epoxy fillers.

Other thermally conductive resources to check out:

Common Thermally Conductive Epoxy Fillers

  • Quartz - 12 W/mK
  • Zinc Oxide - 26 W/mK
  • Alumina (aluminum oxide) - 30 W/mK
  • Aluminum - 200 W/mK
  • Boron Nitride - 360 W/mK
  • Copper - 385 W/mK
  • Silver - 400 W/mK
  • Diamond - 2,300 W/mK

Materials in blue will substantially decrease the electrical resistance of the bulk polymer material. Materials in black will guarantee high electrical resistance in the final epoxy product.

Selecting A Thermally Conductive Epoxy Adhesive

Although it may be tempting to immediately reach for an epoxy product containing a filler with the highest level of thermal conductivity (such as diamond or boron nitride), this is generally a bad idea. Bulk thermal conductivity of the filler material is only part of the story.  Filler shape and particle size, for example, will drastically affect the thermal resistance of the polymer product as well.

If you're unsure about which type of thermally conductive adhesive may be best for your application, feel free to ask us here at Cova Scientific. We would love to learn about your application and help you find a product and supplier that will meet your application specifications.

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